A Custom System with Multiple Sources
- Electron Beam Source
- Wafer Therma/Sources
- Resistance Thermal Sources
- DC Sputter Source
- RF Sputter Source
- ION Beam Source
- Effusion Cell Source
- Laser Ablation Source
Optical Fiber Metallizing System
BENEFITS
- Pure evaporated metals with no possible electrolyte contamination
- Low stress nickel solder barrier eliminates use of Platnimu or Palladium
- Only precious metal needed is Gold
- Solderable in hard and soft wolders
- Tensile strength in excess of 200 KPSI
- Customized metal layers available, e.g. Sn, Er, Ta
- End and window strips of fiber ribbons available to meet customer requirements
Coating Specs
- Tri-metal coating of Ti-Ni-Au
- featuring low stress Nickel coatings
- Ti layer ~0.01µ
- Nickel layers 0.25-2.5µ (application specific)
- Gold layer 0.5-1µ
- >200Kpsi tensile strength
- Metal length 5-25 cm
- Glass length from window strip greater than 6 cm
Description
The system uses a proprietary non line-of-sight process using Ti, Ni and Au for metallizing optical fibers. This technique yields uniform adherent layers of metal than withstands solder re-flow and maintain integrity of strength and has the advantage of depositing low stress Nickel films, alleviating the need for Platinum or Palladium for the solder “barrier” layer.